MOTOROLA

Semiconductor Products Sector
Issuing Division: SPS

UPDATE NOTIFICATION
Generic Copy

13-DEC-2002

Subject:               MOTOROLA UPDATE NOTIFICATION 8343
TITLE:
FINAL MFG CONTRACT TEST QUALIFICATION UPDATE

EFFECTIVE DATE:        14-Dec-2002


AFFECTED CHANGE CATEGORIES
  • SUBCONTRACTOR TEST SITE
  • MOTOROLA TEST SITE


  • AFFECTED PRODUCT DIVISIONS
  • WIRELESS COMMUNICATIONS DIV (VC)
  • ADVANCED VEHICLE SYS DIV (JB)
  • WIRELESS INFRASTRCT SYS DIV (NH
  • BODY ELECT, OCCUPANT SAFETY (JD
  • RF/IF DIV (VW)
  • CPD- COMPUTING PLATFORM DIVISION (NR)
  • SMARTMOS PROD TECH CTR (JS
  • DRIVER INFORMATION DIVISION (JI)
  • NETWORK & COMM SYS DIV (NB)
  • BRD. AND ENT. DIVISION BESD (VE)

  • ADDITIONAL RELIABILITY DATA: None
    REFERENCE: Contact Sales Office ()

    SAMPLES: Contact Local Sales Office
    REFERENCE: Contact Sales Office ()
    Contact your local Motorola Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (JIM TOWNSEND)

    DISCLAIMER
          DISCLAIMER:
         
          MOTOROLA WILL CONSIDER THIS CHANGE APPROVED UNLESS SPECIFIC
          CONDITIONS OF ACCEPTANCE ARE PROVIDED IN WRITING WITHIN 30 DAYS OF
          RECEIPT OF THIS NOTICE. TO DO SO, CONTACT YOUR LOCAL MOTOROLA SALES
          OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          Motorola would like to announce qualification of ChipPac Malaysia as
          an approved sub-contract test supplier in Kuala Lumpur, Malaysia.
         
          As detailed in the Product Bulletin announcing this planned change,
          Motorola planed to introduce a supply expansion plan by qualifying
          Two test contract sites in Malaysia, ChipPac and KESM.
         
          After successful qualification of ChipPac, Motorola intends to
          commence test at ChipPac in December 2002.
         
          The product lines affected by this change are listed in this Update
          to Product Bulletin.
         
          These product lines are all of the product lines from the
          MC9S12Dx256 device, which was used for ChipPac's qualification.
         
          Product lines from the MC9S12Dx128 and MC9S12Dx64 will be released
          to ChipPac after a further qualification is completed on these
          devices.
         
          Further Update Notification's will be issued once further data is
          available on the KESM qualification and the MC9S12Dx128 and
          MC9S12Dx64 sub contract test site correlations.
         
          Related Product Notification: PB # 8118 FINAL MFG CONTRACT TEST
          QUALIFICATION

    CHANGED PART IDENTIFICATION

          Where applicable, traceabiliy code will change to indicate the test
          site. Trace code for ChipPAC is RH. Trace code for KESMalaysia is
          MZ.

    ELECTRICAL CHARACTERISTIC SUMMARY

          Electrical correlation was performed on 5 correlation units, with
          key device characteristics correlated succesfully between Motorola
          KLM and ChipPac Malaysia.

    QUALIFICATION PLAN

          The correlation exercise was performed on two MC9SDx256 product
          lines as described in the original Product Bulletin. Succesfull Bin
          to bin correlation was shown on 3*~500units_112ld_LQFP and
          3*~500units_80ld_QFP as well as datalog comparison.
         
          A further correlation exercise will be completed for the MC9SDx128
          and MC9SDx64 devices. Due to the commonality of the 3 devices the
          exercises for further devices will be 1*~500units_112ld_LQFP and
          1*~500units_80ld_QFP.

    RELIABILITY DATA SUMMARY

          NA


    RELATED NOTIFICATIONS:
    FINAL MFG CONTRACT TEST QUALIFICATION
    AFFECTED DEVICE LIST
    PART
    EC9NDP256MPV25
    KMC9S12A256BCFU
    KMC9S12A256BCPV
    KMC9S12DG256BCFU
    KMC9S12DG256BCPV
    KMC9S12DJ256BCFU
    KMC9S12DJ256BCPV
    KMC9S12DP256BCPV
    KMC9S12DP256BMPV
    KMC9S12DT256BCPV
    MC9S12A256BCFU
    MC9S12A256BCPV
    MC9S12DG256BCFU
    MC9S12DG256BCPV
    MC9S12DG256BMFU
    MC9S12DG256BMPV
    MC9S12DG256BVFU
    MC9S12DG256BVPV
    MC9S12DG256CCFU
    MC9S12DG256CCPV
    MC9S12DG256CMFU
    MC9S12DG256CMPV
    MC9S12DG256CVFU
    MC9S12DG256CVPV
    MC9S12DJ256BCFU
    MC9S12DJ256BCPV
    MC9S12DJ256BMFU
    MC9S12DJ256BMPV
    MC9S12DJ256BVFU
    MC9S12DJ256BVPV
    MC9S12DJ256CCFU
    MC9S12DJ256CCPV
    MC9S12DJ256CMFU
    MC9S12DJ256CMPV
    MC9S12DJ256CVFU
    MC9S12DJ256CVPV
    MC9S12DP256BCPV
    MC9S12DP256BMPV
    MC9S12DP256BVPV
    MC9S12DP256CCPV
    MC9S12DP256CMPV
    MC9S12DP256CVPV
    MC9S12DT256BCPV
    MC9S12DT256BMPV
    MC9S12DT256BVPV
    MC9S12DT256CCPV
    MC9S12DT256CMPV
    MC9S12DT256CVPV
    MC9SA256BCFUR2
    MC9SA256BCPVR2
    MC9SDG256BCFUR2
    MC9SDG256BMFUR2
    MC9SDG256BVFUR2
    MC9SDG256CCFUR2
    MC9SDG256CCPVR2
    MC9SDG256CMFUR2
    MC9SDG256CMPVR2
    MC9SDG256CVFUR2
    MC9SDG256CVPVR2
    MC9SDJ256BCFUR2
    MC9SDJ256BMFUR2
    MC9SDJ256BVFUR2
    MC9SDJ256CCFUR2
    MC9SDJ256CCPVR2
    MC9SDJ256CMFUR2
    MC9SDJ256CMPVR2
    MC9SDJ256CVFUR2
    MC9SDJ256CVPVR2
    MC9SDP256BCPVR2
    MC9SDP256BMPVR2
    MC9SDP256BVPVR2
    MC9SDP256CCPVR2
    MC9SDP256CMPVR2
    MC9SDP256CVPVR2
    MC9SDT256BCFUR2
    MC9SDT256CCPVR2
    MC9SDT256CMPVR2
    MC9SDT256CVPVR2
    PC9S12DG256CPV25
    PC9S12DG256MPV25
    PC9S12DG256VPV25
    PART
    PC9S12DJ256CPV25
    PC9S12DJ256MFU25
    PC9S12DJ256MPV25
    PC9S12DJ256VPV25
    PC9S12DP256CPV25
    PC9S12DP256MPV25
    PC9S12DP256VPV25
    PC9S12DT256CPV25
    PC9S12DT256MPV25
    PC9S12DT256VPV25
    PC9SDJ256MFU25R2
    PC9SDP256MPV25
    PC9SDP256MPV25R2
    PC9SDQ256MFU25
    SC511347BCFU
    SC511347BCFUR2
    SC511347BCPV
    SC511347BCPVR2
    SC511347BMFU
    SC511347BMFUR2
    SC511347BMPV
    SC511347BMPVR2
    SC511347BVFU
    SC511347BVFUR2
    SC511347BVPV
    SC511347BVPVR2