MOTOROLA

Semiconductor Products Sector
Issuing Division: TSG

PRODUCT BULLETIN
Generic Copy

29-MAY-2003


Subject:               MOTOROLA PRODUCT BULLETIN 8948
TITLE:
MPC555 PROBE CAPACITY FLEXIBILITY

EFFECTIVE DATE:        30-May-2003


AFFECTED CHANGE CATEGORIES
  • MOTOROLA FAB SITE


  • AFFECTED PRODUCT DIVISIONS
  • WIRELESS COMMUNICATIONS DIV (VC)
  • ADVANCED VEHICLE SYS DIV (JB)
  • BODY ELECT, OCCUPANT SAFETY (JD
  • DRIVER INFORMATION DIVISION (JI)
  • NETWORK & COMM SYS DIV (NB)

  • ADDITIONAL RELIABILITY DATA: None
    REFERENCE: Contact Sales Office ()

    SAMPLES: Contact Local Sales Office
    REFERENCE: Contact Sales Office ()
    Contact your local Motorola Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (JIM WILSON (ORIGINATOR))

    DISCLAIMER
          DISCLAIMER:
         
          MOTOROLA CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS
          OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL
          MOTOROLA SALES OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          Motorola is pleased to announce an expansion of wafer probe capacity
          for its MOS12 wafer fabrication facility in Tempe, AZ. Additional
          tooling for probe flex capacity is available in Motorolas Austin,
          TX, facilities, at the Austin TX QS9000-certified subcontractor
          Bridgepoint, and at the Taiwan QS9000-certified subcontractor ASE.
         
          All silicon wafer processing will continue to complete under the
          current control plan in MOS12.
         
          Customers could be shipped product from Tempe, Austin, or Taiwan,
          but will not see a mix of sites within the same lot.

    QUALIFICATION PLAN

          Product correlation will follow Motorola internal requirements and
          will be performed by product family. The MPC555 (K62N) is the
          chosen correlation vehicle. Wafers are to be correlated at greater
          than 97 percent bin to bin between sites under the same test
          conditions. Wafers are to be correlated at greater than 99 percent
          yield between sites under the same test conditions. A successful
          correlation will evidence the production readiness of the test
          software and hardware.

    RELIABILITY DATA SUMMARY

          A complete correlation report will be made available upon request.

    CHANGED PART IDENTIFICATION

          There will be no changes to product marking.


    AFFECTED DEVICE LIST
    PART
    MPC555LFAZP40
    SC511658MZP40R2