MOTOROLA

Semiconductor Products Sector
Issuing Division: ADVANCED VEHICLE SYS DIV (JB)

PRODUCT BULLETIN
Generic Copy

18-AUG-2003


Subject:               MOTOROLA PRODUCT BULLETIN 9095
TITLE:
TSPG TECD MPC555 FINAL TEST XFER

EFFECTIVE DATE:        01-Sep-2003


AFFECTED CHANGE CATEGORIES
  • SUBCONTRACTOR TEST SITE


  • AFFECTED PRODUCT DIVISIONS
  • WIRELESS COMMUNICATIONS DIV (VC)
  • ADVANCED VEHICLE SYS DIV (JB)
  • BODY ELECT, OCCUPANT SAFETY (JD
  • DRIVER INFORMATION DIVISION (JI)
  • NETWORK & COMM SYS DIV (NB)

  • ADDITIONAL RELIABILITY DATA: None
    REFERENCE: Contact Sales Office ()

    SAMPLES: Contact Local Sales Office
    REFERENCE: Contact Sales Office ()
    Contact your local Motorola Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (PAUL J. WHIPPLE)

    DISCLAIMER
          DISCLAIMER:
         
          MOTOROLA CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS
          OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL
          MOTOROLA SALES OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          Motorola is pleased to announce an expansion of final test capacity
          for its KLM final test facility in Kuala Lumpur, Malaysia.
          Additional tooling for final test flex capacity is available in the
          KTM facility in Kuala Lumpur, Malaysia. All assembly processing
          will continue to complete under the current control plan in KLM
          assembly.
         
          Customers could be shipped product from KTM, but will not see a mix
          of sites within the same lot.

    QUALIFICATION PLAN

          3 lots tested at KTM and then retested with 1,000 units each
          correlated at temperatures of -40, and +145 Deg C. Correlation is
          attained when all bins and parametric data matches.

    RELIABILITY DATA SUMMARY

          All 3 lots matched binouts and parametric data on good and rejects
          samples.

    ELECTRICAL CHARACTERISTIC SUMMARY

          Electrical characterization data was taken at both temperatures on
          significant current drain configurations including operating and
          standby options. All values exceeded the requirement of a cpk of
          1.5 or greater at both temperatures.

    CHANGED PART IDENTIFICATION

          The device Trace Code marking will change to include the test site
          code for all MPC555 Rev M devices:
         
          Old Trace Code Marking: UQWJ0242
          New Trace Code Marking: UQXXWJ0242
          where U=Wafer Fab, Q=Assembly, XX=Test Site, WJ=Wafer Lot
         
          MZ is the test site code for KTM Test.
          Q is the test site code for KLM Test.


    AFFECTED DEVICE LIST
    PART
    MPC555LFAZP40
    MPC555LFCZP40
    SC511658MZP40
    SC511658MZP40R2