MOTOROLA

 

Semiconductor Products Sector

Issuing Division: 32 BIT EMBEDDED CONTROLLER DIVISION - TECD


PRODUCT BULLETIN

Generic Copy


02-DEC-2003


  
Subject:               MOTOROLA PRODUCT BULLETIN 9405
TITLE:

TSPG-TECD MPC561/562 TEST SITE XFER


EFFECTIVE DATE:        03-Dec-2003


AFFECTED CHANGE CATEGORIES

·  MOTOROLA TEST SITE



AFFECTED PRODUCT DIVISIONS

·  ADVANCED VEHICLE SYS DIV (JB)

·  BODY ELECT, OCCUPANT SAFETY (JD

·  DRIVER INFORMATION DIVISION (JI)

·  NETWORK & COMMUNICATION SYSTEMS DIVISION - NCSD

·  32 BIT EMBEDDED CONTROLLER DIVISION - TECD


ADDITIONAL RELIABILITY DATA: Available
REFERENCE: Contact Sales Office (RLJV50)

Contact your local Motorola Sales Office.


SAMPLES: Contact Local Sales Office
REFERENCE: Contact Sales Office ()

Contact your local Motorola Sales Office.


For any questions concerning this notification:
REFERENCE: Contact Sales Office (RON LOWMAN)

DISCLAIMER
      DISCLAIMER:
     
      MOTOROLA CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS
      OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL
      MOTOROLA SALES OFFICE.


DO NOT REPLY TO THIS MESSAGE.
GPCN FORMAT:           CUSTOMER

DESCRIPTION AND PURPOSE

      Motorola Semiconductor Products Sector announces the final test
      qualification of the MPC561 and MPC562 device families in Kuala
      Lumpur, Malaysia (KLM). The final test site currently is Austin,
      Texas. Assembly for these device families is also located at KLM,
      so adding test to the same manufacturing site improves our
      production efficiency and cycle times to support customer demands.

QUALIFICATION PLAN

      3000 units from 2 different wafer lots were tested at Austin and
      then retested at KLM and correlated at temperatures of -40, +25,
      and +145 Deg C. Correlation is attained when all good and reject
      bins and parametric data matches.

RELIABILITY DATA SUMMARY

      All unit matched binouts and parametric data on good and rejects
      samples.

ELECTRICAL CHARACTERISTIC SUMMARY

      Electrical characterization data was taken at all three temperatures
      on all parametric rejects at both test sites and compared with no
      significant discrepancies found. All Cpk's were above values of 1.66.

CHANGED PART IDENTIFICATION

      There are no identification changes as the test site is not marked
      in the traceability code.


AFFECTED DEVICE LIST

 

PART

MPC561CZP40

MPC561CZP66

MPC561MZP56

MPC561MZP56R2

MPC561MZP66

MPC562CZP40

MPC562CZP66

MPC562MZP56

MPC562MZP56R2

MPC562MZP66

PPC561MZP56

PPC561MZP56R2

PPC561MZP66

PPC562MZP56

PPC562MZP56R2

PPC562MZP66

SPC562MZP56D

SPC562MZP56DR2