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PRODUCT BULLETIN
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ISSUE DATE:19-Dec-2003
NOTIFICATION:9468
TITLE:TSPG-TECD MMC2113/2114 TEST SITE XFER
EFFECTIVE DATE:20-Dec-2003


Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: Indicated by asterisk (*)

DEVICE(S)

MPN
MMC2113CFCPU33
MMC2113CFCPV33
MMC2113CFCVF33
MMC2114CFCPU33
MMC2114CFCPV33
*MMC2114CFCVF33
XMC2113CFCPU33
XMC2113CFCPV33
XMC2113CFCVF33
XMC2114CFCPU33
XMC2114CFCPV33
*XMC2114CFCVF33



AFFECTED CHANGE CATEGORIES
  • TEST SITE


  • DESCRIPTION OF CHANGE

    Motorola Semiconductor Products Sector announces the final test qualification of the MMC2113 and MMC2114 device families in Kuala Lumpur, Malaysia (KLM). The final test site will transfer from Austin, Texas to KLM. Assembly for these device families is also located at KLM, so adding test to the same manufacturing site improves our production efficiency and cycle times to support customer demands.



    REASON FOR CHANGE

    ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

    NOTE:
    THE CHANGE(S) SPECIFIED IN THIS NOTIFICATION WILL BE IMPLEMENTED ON THE EFFECTIVE DATE LISTED ABOVE. To request further data or inquire about samples, please enter a Service Request


    QUALIFICATION STATUS:     N/A

    QUALIFICATION PLAN:

    5000 units from 2 different wafer lots were tested at KLM and then retested at Austin and correlated at temperatures of -40, +25, and +105 Deg C. Correlation is attained when all good and reject bins match.



    RELIABILITY DATA SUMMARY:

    Data available upon request.



    ELECTRICAL CHARACTERISTIC SUMMARY:

    Electrical characterization data was taken at all three temperatures on 30 units at both test sites and compared with no significant discrepancies found.





    CHANGED PART IDENTIFICATION:

    There are no identification changes as the test site is not marked in the traceability code.





    ATTACHMENT(S):
    N/A