FREESCALE

Freescale Semiconductor, Inc.
Issuing Division: 32 BIT EMBEDDED CONTROLLER DIVISION - TECD ( JB )

PRODUCT BULLETIN
Generic Copy

06-MAY-2004


Subject:               FREESCALE PRODUCT BULLETIN 9847
TITLE:
TSPG-TECD PB-FREE PACKAGE QUAL

EFFECTIVE DATE:        07-May-2004


AFFECTED CHANGE CATEGORIES
  • ASSEMBLY PROCESS
  • PACKAGE CHANGE


  • AFFECTED PRODUCT DIVISIONS
  • COMPUTING PLATFORM DIVISION - CPD ( NR )
  • NETWORK & COMM SYS DIV - NCSD ( NB / NC / ND / NI / NM )
  • ANALOG PRODUCT DIVISION - APD ( JS )
  • DIGITAL AUDIO, RADIO & TELEMATICS DIVISION - DART ( JI )
  • 8/16 BIT DIVISION ( JG )
  • 32 BIT EMBEDDED CONTROLLER DIVISION - TECD ( JB )
  • RADIO PRODUCTS DIVISION - RPD ( VW )
  • WIRELESS SOLUTIONS DIVISION - WSD ( VC )
  • RADIO FREQUENCY DIVISION - RFD ( NH )

  • ADDITIONAL RELIABILITY DATA: Available
    REFERENCE: Contact Sales Office (RLJV50)
    Contact your local Sales Office.

    SAMPLES: Contact Local Sales Office
    REFERENCE: Contact Sales Office ()
    Contact your local Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (CHRISTY MALLINGER (ORIGINATOR))

    DISCLAIMER
          DISCLAIMER:
         
          FREESCALE CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS
          OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL
          SALES OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          The 32-Bit Embedded Controller Division (TECD) is pleased to
          announce the MC qualification of the 160 QFP (Quad Flat Pack)
          Pb(lead)-free package at the KLM assembly site in Kuala Lumpur,
          Malaysia.
         
          Package code 8101: QFP 160 28*28*3.3P0.65
         
          Properties of the Pb(leaded) devices are:
          Termination finish - 90 percent Sn, 10 percent Pb (Nominal)
          MSL - 3
          Reflow temperature - 240 degrees C
         
          Properties of the Pb(lead)-free devices are:
          Termination finish - 100 percent Sn (Matte)
          MSL - 3
          Reflow temperature - 245 degrees C
         
          Note: Although the package above is now qualified Pb(lead)-free,
          not all TECD products currently offered in this package type will be
          available in the Pb-free solution. Additionally, the Pb(lead)-free
          qualification does not affect the availability of current tinlead
          finish products.

    QUALIFICATION PLAN

          MSL Study, Temperature Humidity Bias (THB) Autoclave, Temperature
          Cycle, Bond Pull, Bond Shear, Solderability, and Whiskers.

    RELIABILITY DATA SUMMARY

          Test at -40 degrees C to 125 degrees C
         
         
          Preconditioning:
         
          JEDEC MSL 3 at 245 deg C
          192hrs at (30 deg C/60 percent RH) + 3 x 245 deg C Reflow
          Reflow requirement for 160 QFP Pb(lead)-free is MSL 3 at 245 deg C.
         
          Preconditioned and THB
          85 deg C/85 percent RH for 1000 hours
          SC430204FT (GMPWX)
          JEDEC MSL 3______1 Lot_____0/77
          JEDEC MSL 3______2 Lot_____0/77
          JEDEC MSL 3______3 Lot_____0/77
         
         
          Preconditioned and Autoclave
          121 deg C/100 percent RH/15 psig for 96 hours
          SC430204FT (GMPWX)
          JEDEC MSL 3______1 Lot_____0/77
          JEDEC MSL 3______2 Lot_____0/77
          JEDEC MSL 3______3 Lot_____0/77
         
         
          Preconditioned and Temperature Cycling
          -65 deg C to +150 deg C for 500 cycles
          SC430204FT (GMPWX)
          JEDEC MSL 3______1 Lot_____0/77
          JEDEC MSL 3______2 Lot_____0/77
          JEDEC MSL 3______3 Lot_____0/77
         
         
          Bond Pull Strength (Post Preconditioning)
          SC430204FT (GMPWX)
          Cpk is greater than 2.07
         
          Bond Shear
          SC430204FT (GMPWX)
          Cpk is greater than 2.06
         
         
          Solderability (Post Preconditioning)
          2 hours bake at 200 deg C and 8 hours steamage
          SC430204FT (GMPWX)
          1 Lot_____0/15
          2 Lot_____0/15
          3 Lot_____0/15
         
         
          Generic Whisker Data
          Temperature cycle -55 deg C to 85 deg C for 1000 cycles
          MC68302 132 PQFP in KLM
          Less than 40 microns at 1000 cycles

    ELECTRICAL CHARACTERISTIC SUMMARY

          No change to Electrical characterization.

    CHANGED PART IDENTIFICATION

          The package suffix in the orderable part number and on the part
          marking will change from FT for leaded devices to AB for
          Pb(lead)-free devices.
         
          For example: MC68376BACFT20 becomes MC68376BACAB20.


    AFFECTED DEVICE LIST

    PART
    MC68336ACAB20
    MC68336ACAB25
    MC68336ACFT20
    MC68336ACFT25
    MC68336AMAB20
    MC68336AMFT20
    MC68336AMFT20B1
    MC68336GCAB20
    MC68336GCAB25
    MC68336GCFT20
    MC68336GCFT25
    MC68336GMAB20
    MC68336GMFT20
    MC68336GVAB20
    MC68336GVAB25
    MC68336GVFT20
    MC68336GVFT25
    MC68376BACFT20
    MC68376BACFT25
    MC68376BAMFT20
    MC68376BAVFT20
    MC68376BAVFT25
    MC68376BGCFT20
    MC68376BGCFT20B1
    MC68376BGCFT25
    MC68376BGMFT20
    MC68376BGMFT20B1
    MC68376BGVFT20
    MC68376BGVFT25
    MCF5206AB16A
    MCF5206AB25A
    MCF5206AB33A
    MCF5206CAB16A
    MCF5206CAB25A
    MCF5206CFT16A
    MCF5206CFT25A
    MCF5206EAB40
    MCF5206EAB54
    MCF5206ECAB40
    MCF5206ECFT40
    MCF5206EFT40
    MCF5206EFT54
    MCF5206FT16
    MCF5206FT16A
    MCF5206FT25
    MCF5206FT25A
    MCF5206FT25AB1
    MCF5206FT25B1
    MCF5206FT33A
    PC68336GCAB20
    PCF5206ECFT40A
    PCF5206EFT40A
    PCF5206EFT54A
    SC439521GMFT25
    SPAK5206EFT40
    SPAK5206EFT54
    SPAK5206FT25
    SPMC68376BACFT20
    SPMC68376BAVFT25
    SPMC68376BGCFT20
    SPMC68376BGMFT20
    XC370737FU
    XCF5206ECFT40
    XCF5206EFT40
    XCF5206EFT54
    XCF5206FT16
    XCF5206FT25
    XCF5206FT25B1
    XPC509L3CFT25