FREESCALE

Freescale Semiconductor, Inc.
Issuing Division: 32 BIT EMBEDDED CONTROLLER DIVISION - TECD ( JB )

PRODUCT BULLETIN
Generic Copy

04-MAY-2004


Subject:               FREESCALE PRODUCT BULLETIN 9851
TITLE:
TSPG TECD MPC555 REV K3 FINAL TEST XFER

EFFECTIVE DATE:        05-May-2004


AFFECTED CHANGE CATEGORIES
  • TEST SITE


  • AFFECTED PRODUCT DIVISIONS
  • COMPUTING PLATFORM DIVISION - CPD ( NR )
  • NETWORK & COMM SYS DIV - NCSD ( NB / NC / ND / NI / NM )
  • ANALOG PRODUCT DIVISION - APD ( JS )
  • DIGITAL AUDIO, RADIO & TELEMATICS DIVISION - DART ( JI )
  • 8/16 BIT DIVISION ( JG )
  • 32 BIT EMBEDDED CONTROLLER DIVISION - TECD ( JB )
  • RADIO PRODUCTS DIVISION - RPD ( VW )
  • WIRELESS SOLUTIONS DIVISION - WSD ( VC )
  • RADIO FREQUENCY DIVISION - RFD ( NH )

  • ADDITIONAL RELIABILITY DATA: Available
    REFERENCE: Contact Sales Office (RLJV50)
    Contact your local Sales Office.

    SAMPLES: Contact Local Sales Office
    REFERENCE: Contact Sales Office ()
    Contact your local Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (GEOFFREY P. MASLIN)

    DISCLAIMER
          DISCLAIMER:
         
          FREESCALE CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS
          OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL
          SALES OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          Freescale Semiconductor is pleased to announce an expansion of final
          test capacity for its KLM final test facility in Kuala Lumpur,
          Malaysia. Additional tooling for final test flex capacity is
          available in the KTM facility in Kuala Lumpur, Malaysia. There will
          be no changes to the test hardware platform or test software for
          this transfer. All assembly processing will continue to complete
          under the current control plan in KLM assembly.
         
          Customers could be shipped product from KTM, but will not see a mix
          of sites within the same lot.

    QUALIFICATION PLAN

          Three lots tested at KTM and then retested with 1,000 units each
          correlated at temperatures of -40, and +145 Deg C. Correlation is
          attained when all bins and parametric data matches.

    RELIABILITY DATA SUMMARY

          The data on all lots matched binouts and parametric data on good and
          reject samples.

    ELECTRICAL CHARACTERISTIC SUMMARY

          Electrical characterization data was taken at both temperatures on
          significant operating current drain configurations. All values
          exceeded the requirement of a cpk of 1.5 or greater at both
          temperatures.

    CHANGED PART IDENTIFICATION

          The device Trace Code marking will change to include the test site
          code for all MPC555 Rev K3 devices:
         
          Old Trace Code Marking: UQWJ0412
          New Trace Code Marking: UQXXWJ0412
          where U=Wafer Fab, Q=Assembly, XX=Test Site, WJ=Wafer Lot
         
          MZ is the test site code for KTM Test.
          Q is the test site code for KLM Test.


    AFFECTED DEVICE LIST

    PART
    MPC555LFCZP40
    MPC555LFMZP40
    MPC555LFMZP40R2
    SC511653MZP40
    SC511653MZP40R2
    SC511660MZP40