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PRODUCT BULLETIN
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ISSUE DATE:02-Jun-2004
NOTIFICATION:9904
TITLE:TSPG-TECD PB-FREE,HALIDE-FREE PKG QUAL
EFFECTIVE DATE:03-Jun-2004


Because of an order from the United States International Trade Commission, BGA-packaged product lines and part numbers indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010: Indicated by asterisk (*)

DEVICE(S)

MPN
KMCF5249VF140
*KXCF5272VF66
*MCF5249CVF140
*MCF5249VF140
*MCF5272CVF66
*MCF5272CVM66
*MCF5272VF66
*MCF5272VF66R2
*MCF5272VM66
*MCF5280CVF66
*MCF5280CVF80
*MCF5280CVM66
*MCF5280CVM80
*MCF5281CVF66
*MCF5281CVF80
*MCF5281CVM66
*MCF5281CVM80
*MCF5282CVF66
*MCF5282CVF80
*MCF5282CVM66
*MCF5282CVM80
MMC2113CFCVF33
*MMC2114CFCVF33
*PCF5272VF
*PCF5272VF66
PCF5272VM66
PCF5280CVF66
PCF5280CVF80
PCF5281CVF66
PCF5281CVF80
PCF5282CVF66
PCF5282CVF80
*SCF5249VF140
*XCF5249VF140
*XCF5272CVF66
XCF5272VF66
XMC2113CFCVF33
*XMC2114CFCVF33



AFFECTED CHANGE CATEGORIES
  • ASSEMBLY PROCESS

  • PACKAGE CHANGE


  • DESCRIPTION OF CHANGE

    The 32-Bit Embedded Controller Division (TECD) is pleased to announce the MC qualification for Pb(lead)-free and halide-free (high temperature capable) packaging on various MAPBGA's (MAP Ball Grid Array) at the KLM assembly site in Kuala Lumpur, Malaysia. Package code 5220: MAPBGA 196 15*15*0.8P1.0 Package code 5229: MAPBGA 160 15*15*0.8P1.0 Package code 5246: MAPBGA 256 17*17*0.8P1.0 Properties of the Pb(leaded) devices are: Termination finish - 62 percent Sn, 36 percent Pb, 2 percent Ag MSL - 3 Reflow temperature - 240 degrees C Properties of the Pb(lead)-free and halide-free devices are: Termination finish - 95.5 percent Sn, 4.0 percent Ag, 0.5 percent Cu MSL - 3 Reflow temperature - 260 degrees C Note: Although the packages above are now qualified Pb(lead)-free and halide-free, not all TECD products currently offered in these package types will be available in the Pb-free/halide-free solution. Additionally, the Pb(lead)-free and halide-free qualification does not affect the availability of current tin-lead finish products.



    REASON FOR CHANGE

    ANTICIPATED IMPACT OF PRODUCT CHANGE(FORM, FIT, FUNCTION, OR RELIABILITY)

    NOTE:
    THE CHANGE(S) SPECIFIED IN THIS NOTIFICATION WILL BE IMPLEMENTED ON THE EFFECTIVE DATE LISTED ABOVE. To request further data or inquire about samples, please enter a Service Request


    QUALIFICATION STATUS:     N/A

    QUALIFICATION PLAN:

    MSL Study, High Temperature Op Life (HTOL), Flash Data Retention Bake (DR), Temperature Humidity Bias (THB), Autoclave (AC), Temperature Cycle (TC), Early Life Failure Rate (ELFR), Bond Pull, Bond Shear, Solder Ball Shear, and Solderability.



    RELIABILITY DATA SUMMARY:

    Test at -40 degrees C to 85 degrees C HTOL 125 deg C for 168, 504, and 1008 hours MCF5282: 1 Lot_____0/77 at 2016 hours 2 Lot_____0/77 at 1008 hours DR Bake 125 deg C for 1000 hours MCF5282: 1 Lot_____0/77 2 Lot_____0/77 Preconditioning: JEDEC MSL 3 at 260 deg C 192hrs at (30 deg C/60 percent RH) + 3 x 260 deg C Reflow Reflow requirement for MAPBGA's Pb(lead)-free and halide-free is MSL 3 at 260 deg C. Moisture Characterization MCF5272: JEDEC MSL 3_____1 Lot_____0/22 Preconditioned and THB 85 deg C/85 percent RH for 1008 hours MCF5282: JEDEC MSL 3______1 Lot_____0/77 JEDEC MSL 3______2 Lot_____0/77 JEDEC MSL 3______3 Lot_____0/77 JEDEC MSL 3______4 Lot_____0/77 Preconditioned and Autoclave 121 deg C/100 percent RH/15 psig for 96 hours MCF5282: JEDEC MSL 3______1 Lot_____0/77 JEDEC MSL 3______2 Lot_____0/77 JEDEC MSL 3______3 Lot_____0/77 MCF5272: JEDEC MSL 3______1 Lot_____0/77 Preconditioned and Temperature Cycling -65 deg C to +150 deg C for 500 cycles MCF5282: JEDEC MSL 3______1 Lot_____0/77 JEDEC MSL 3______2 Lot_____0/77 JEDEC MSL 3______3 Lot_____0/77 MCF5272: JEDEC MSL 3______1 Lot_____0/77 Preconditioned and ELFR TA equals 125 deg C for 48 hours MPC5200: 1 Lot_____0/532 3 Lot_____0/883 4 Lot_____0/1215 Bond Pull Strength (Post Preconditioning) MCF5282: Cpk is greater than 3.12 Bond Shear (Post Preconditioning) MCF5282: Cpk is greater than 3.35 Solder Ball Shear (Post Preconditioning) Two 220 deg C reflow cycles before shear MCF5282: Cpk is greater than 4.34 Solderability (Post Preconditioning) 2 hours bake at 200 deg C and 8 hours steamage MCF5282: 1 Lot______0/15 2 Lot______0/15 3 Lot______0/15 4 Lot______0/15 5 Lot______0/15



    ELECTRICAL CHARACTERISTIC SUMMARY:

    No change to Electrical characterization.





    CHANGED PART IDENTIFICATION:

    The package suffix in the orderable part number and on the part marking will change from 'VF' for leaded devices to 'VM' for Pb(lead)-free and halide-free devices. For example: MCF5282CVF66 becomes MCF5282CVM66





    ATTACHMENT(S):
    N/A