Product Change Notice

F91C Mask Set Introduction

Motorola Inc. will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice.

Issue Date Effective Date Notification #
13-Feb-95 24-May-95 R00268

Affected Change Categories
Affected Product Divisions
MC68030 (All FE, RC suffixes)
Imaging and Storage
Additional Reliability Data
Samples
Included
Available

For any questions concerning this notification:

Contact:

Mai Tran

Phone:

(512) 895-3981

Description and Purpose

Motorola is pleased to announce a new shrink version of the 68030. This mask set is implemented using 0.8 micron technology at our Tohoku Facility (commonly referred to as TSC) based in Sendai, Japan. TSC is one of the facilities that currently manufactures the existing 1.0 Micron 68030. Product manufactured from this new mask set will be functionally and electrically equivalent to the current production mask sets (C74N and D66C). Parts from this new mask set can be identified with 1F91C top side marking.

The purpose of this change is to provide manufacturing capacity necessary to meet this year's higher demand requirement.

Contact Customer Service for samples.

Reliability / Qualification Plan

TSC 0.8 Micron 68030 (F91C) Qualification Result


Life Test (6.0V, 125 Deg C)
Wafer Lot# 168 Hrs 504 Hrs 1008 Hrs
A10001A 0/77 0/77 0/77
A10002A 0/77 0/77 0/77
A10003 0/77 0/77 0/77

Bake (175 Deg C)
Wafer Lot# 168 Hrs 504 Hrs 1008 Hrs
A10001A 0/77 0/77 0/77
A10002A 0/77 0/77 0/77
A10003 0/77 0/77 0/77

ESD (Human Body Model)
Wafer Lot# 500 V 1000 V 1500 V 2000V
A10001A 0/2 0/2 0/2 3/3*
A10002A 0/2 0/2 0/2 3/3*
A10003 0/2 0/2 0/2 3/3*
A10004B - - - 0/6

*A layout error caused the first 3 lots to fail 3 input pins @2000V; Correction was made and verified on Lot 4.
Last modified: