Shrink Wrapping Tray Products

Motorola Inc. will consider this change approved unless specific conditions of acceptance are provided in writing within 30 days of receipt of this notice.

Issue DateEffective DateNotification #
08-Apr-96 18-Jul-96 R00315

Affected Change Categories
    
Affected Product Divisions
See Below
    
Imaging and Storage
Additional Reliability Data
    
Samples
Included
    
Available

For any questions concerning this notification:

Contact: Tiffany Jackson
Phone: (512) 895-8681

Description and Purpose

Additional HPESD PAL Codes Affected:

MAAA MAAB MAAC MAAD MAAE
MAAF MAAG MAAH MAAI MAAM
MAAN MAAO MAAP MAAQ MAAR
MAAS MAAT MAAV MACG MAFA
MAFB MAFE MAFF MAFG MAFH
MAFI MAFK MAFM MAFN MAFQ

RISC PAL Codes Affected:

MRAA MRAB MRAC MRAD MRIA
MRIB MRID MRIG MRIH MRIJ
MRIX

Implementation of shrink wrapping tray products to replace plastic bandstraps and cardboard sheets. Shrink wrapping is an overwrapping method for retaining multiple trays. This simple procedure-wrapping, sealing, and shrinking- enhances productivity and product quality.

  1. The film's clear transparent properties allows operators to handle product without concern to orientation during film removal.
  2. The film will protect leads and packages from particulate contamination and restrict accessibility to leads by providing lead protection.
  3. This film eliminates the need for cardboard to be introduced to a manufacturing operation.
  4. The films static decay time is less than 2 seconds.
  5. The films surface resistivity is 10E12 to 10E14 ohms/cm sq.

Shrink Wrapping Highlights:

Clear Skintight Shrink
Static Dissipative Film
Better Product Protection
Improved Tray Rigidity
Eliminates Cardbaord Usage
Delivers Cleaner Products
Minimizes Handling
Recyclable Waste
Note: To open cut film (with scissors or sharp edge) along the side seam of the tray stack and peel.

Reliability/Qualification Summary

Supporting Data:
Current Methods vs. Shrink Wrap:
The packaging methods will include the following order:

Current MethodShrinkwrap Method
Cover Tray Cover Tray
2 to 5 trays of devices 2 to 5 trays of devices
2 cardboard sheets (Top & Bottom) -----
3 plastic bands (1 ea. end and center) -----
Clear plastic bag Shrink film


Current Drypacking MethodShrinkwrap w/Drypack Method
Cover Tray Cover Tray
2 to 5 trays of devices 2 to 5 trays of devices
2 cardboard sheets (Top & Bottom) -----
3 plastic bands (1 ea. end and center) -----
----- Shrink film
Drypack bag Drypack bag

ESD - IC Mortality Failure Rates:

The Cryovac EPD-512 is a 150 gauge, 3-ply, coextruded polyolefin film made with a static-dissipative core and clean outer ply polymers. It has a static decay rate of less than 2 seconds and a surface resistivity of less than 10E14 ohms/cm sq. after shrinkage. All of its properties together provide exceptional clarity, skintight shrinkage and static-free protection. The excellent shrinkage of Cryovac EPD-512 film and the natural air gap of tray assemblies provide static protection for essentially all devices. Through IC mortality test, we discovered that the Cryovac EPD-512 film was very capable of securing our 11x11 PGA test devices from ESD failures. Using a Human Body Model (HBM) instrument (100pF/1500 ohms) with a 3 oz. electrode, which reduced the air gap between the film and the tray assembly, revealed no failures at or below 12 kiliovolts out of 50 Mosfet dies samples. There was only one PGA failure at 16 kilovolts and 3 failures detected at 20 kilovolts. However, using the same instrument with a 1 oz. electrode, there were no failed PGA's at or below 20 kilovolts for the Cryovac EPD-512 film. All of the Mosfet IC dies had a HBM ESD sensitivity of approximately 250 volts.

Electrode: 1 oz. Probe Sample Size: 50

Test (KV)EPD-512049-1SP5
12 0 0 0
16 0 0 0
20 0 0 0

Electrode: 3 oz. Probe Sample Size: 50

Test (KV)EPD-512049-1SP5
12 0 0 0
16 1 1 3
20 3 5 7

Drop Tests Results for Lead Inspection Due to Coplanarity:

Four (4') ft. drop tests were conducted on both, shrink wrapped and bandstrapped trays, to determine the number of defected devices. Drops are performed to simulate lead damage introduced to devices during shipping transitions. A drop tested package requires all packaging items (plastic bags, cardboard sheets, form end caps, etc.) and undergoes ten drops (1 corner, 4 edges, and 5 sides) per box. Coplanarity inspections are performed before and after each drop to quantify the amount of lead damage. In comparing the bandstrapped and shrink wrapped packages, the following drop test data were calculated. Subsequent drop tests are being conducted in pursuit of greater yields.

T-Test Paired Two Sample for Coplanarity Means: Bandstrapping

   
Pre-Drop (Microns)
   
Post-Drop (Microns)
Mean 35.42
   
46.90
Variance 272.40
   
1197.66
Standard Deviation 16.50
   
34.61
Observations 300
   
300
Pearson Correlation
   
0.44
   
Hypothesized Mean Difference
   
0
   
DF
   
299
   
T Stat
   
-6.39
   
P (T<=T) One-Tail
   
3.25E-10
   
T Critical One-Tail
   
1.65
   
P (T<=T) Two-Tail
   
6.49E-10
   
Critical Two-Tail
   
1.97
   

T-Test Paired Two Sample for Coplanarity Means: Shrink Wrapping

   
Pre-Drop (Microns)
   
Post-Drop (Microns)
Mean 36.18
   
35.42
Variance 268.99
   
272.41
Standard Deviation 16.40
   
16.50
Observations 300
   
300
Pearson Correlation
   
0.99
   
Hypothesized Mean Difference
   
0
   
DF
   
299
   
T Stat
   
5.03
   
P (T<=T) One-Tail
   
4.32E-07
   
T Critical One-Tail
   
1.65
   
P (T<=T) Two-Tail
   
8.65E-07
   
Critical Two-Tail
   
1.97
   

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