                          MANUFACTURING PCB
                          -----------------

DATE:19/12/2016

CUSTOMER: NXP

FILE : NXH3770 SDK V1-0
     
Multilayer ML6

_______________________________________________________________________________
		                GERBER FILES 274X
-------------------------------------------------------------------------------

TOP LAYER	             : NXH3770_SDK_V1-0.top
INTERNAL2 LAYER              : NXH3770_SDK_V1-0.in2
INTERNAL3 LAYER              : NXH3770_SDK_V1-0.in3
INTERNAL4 LAYER              : NXH3770_SDK_V1-0.in4
INTERNAL5 LAYER              : NXH3770_SDK_V1-0.in5
BOTTOM  LAYER                : NXH3770_SDK_V1-0.bot
SOLDERMASK TOP	             : NXH3770_SDK_V1-0.smt
SOLDERMASK BOTTOM            : NXH3770_SDK_V1-0.smb

DRILL DRAWING 1/2             : NXH3770_SDK_V1-0.drd1
DRILL DRAWING 2/2             : NXH3770_SDK_V1-0.drd2


SILKSCREEN TOP			: NXH3770_SDK_V1-0.sst
 
PASTEMASK TOP                : NXH3770_SDK_V1-0.spt
      


_______________________________________________________________________________
		                 PDF - TXT FILES
-------------------------------------------------------------------------------

DRILL FILE (Layer TOP to BOTTOM): NXH3770_SDK_V1-0_1-6.drl
DRILL FILE (Layer TOP to 2)	: NXH3770_SDK_V1-0_1-2.drl
DRILL FILE (Layer 2 to 3)	: NXH3770_SDK_V1-0_2-3.drl

DRILL DRAWING			: NXH3770_SDK_V1-0_drd.pdf

PANEL DRAWING			: NXH3770_SDK_V1-0_panel.pdf

TECHNICAL SPECIFICATIONS        : NXH3770_SDK_V1-0_SPEC.pdf


STACKUP				: Artemis_NXH3770 SDK_HDI06_2+2+2_TG150HF_1.56mm_35m_Rev1.pdf

-------------------------------------------------------------------------------
ARTEMIS  S.BEAUGEAIS	 	TEL: +33 (0)2 41 48 41 40 
                      		FAX: +33 (0)2.41.48.41.44 
                      		e-mail:s.beaugeais@artemis-cad.com                                      
-------------------------------------------------------------------------------