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Out of the Box2
Getting Ready3
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The NXP analog product development board provides an easy-to-use platform to evaluate NXP products. The board supports a range of analog, mixed-signal and power solutions. They incorporate monolithic integrated circuits (ICs) and system-in-package (SiP) based on proven high-volume technologies. NXP products offer longer battery life, a smaller form factors, reduced component counts, lower system cost and improved performance for powering state-of-the-art systems.
This page will guide you through the setup and use the TAA3033DB1649 demo board.
The kit includes the TAA3033DB1649 demo board with automotive-grade components designed to evaluate low-side application. Figure 1 and Figure 2 show the top and bottom views of the demo board.
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The TAA3033 Ringo software with GUI enables communication with the integrated circuit (IC) using a PC and the RDK01DB1563 USB-to-inter-integrated circuit (USB-to-I²C) interface kit. When used with the demo board, the Ringo GUI supports development and evaluation. The tool enables:
Refer to UM12429 for detailed information on GUI setup, features and operation.
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The table below provides furtherdetails for the TAA3033DB1649 demo board.
Table 1. Specifications.
| Symbol | Description | Specification | Unit |
|---|---|---|---|
| Vbat | Input battery voltage | 800 | V |
| Io(max) | Maximum output current | 4.5 | A |
| VCC | Supply voltage | 12 to 28 | V |
| Vstart | Start voltage at VCC pin | 11 | V |
| Vstop | Stop voltage at VCC pin | 10 | V |
| Vth(ena) | Enable threshold voltage | 1.5 | V |
| Vth(dis) | Disable threshold voltage | 1.3 | V |
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The following application and control features highlight the key capabilities of the TAA3033.
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To demonstrate the performance of the TAA3033DB1649 demo board, a test setup is used to charge a 1 mF capacitor to 800 V. The test equipment includes:
Figure 3 shows the test setup with the demo board. To prevent reverse current flow during evaluation, an external diode is connected externally in series between the positive terminal of the HVDC power supply and the BAT+ terminal of the demo board.
A fuse is also connected externally in series with the diode. For accurate measurement with minimum disturbance to the application, the sense signal must be measured close to the IC (see Figure 4).
As shown in Figure 4, a 1:1 probe is connected directly across capacitor C3 to measure of the sense node capacitor (SNC) signal. A differential probe is used to measure the capacitor voltage (VCAP). Several test points are provided across the demo board to measure signals such as Enable, Fault, Ready, Vcc, switching node voltage and Gate. The board also includes a solder-blob jumper which is shorted by default.
The solder bridge may be opened and an external wire loop attached for inductor current measurement.
Figure 4. SNC Signal Measurement.
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This section describes the test procedure for evaluating the demo board. The same procedure can be used to evaluate both the TAA3033DB1649 and TAA3033DB1650 demo boards.
If the IC is already programmed with the required settings, follow these steps:
To evaluate the precharge operation with other configurable settings, follow this procedure:
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When the applied VCC voltage exceeds the start threshold and the voltage at the enable pin exceeds the enable threshold, the IC operation starts (see Table 1). Figure 5 shows the startup behavior at zero battery voltage.
The oscilloscope channels are assigned as follows:
When the voltage at the enable pin exceeds the threshold, the fault pin goes high and the gate switching starts. Gate switching starts at the minimum duty cycle and then increases. The RDY pin remains low until the end of precharging operation.
Figure 5. Startup Behavior.
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