MOTOROLA

Semiconductor Products Sector
Issuing Division: SPS

PRODUCT BULLETIN
Generic Copy

19-AUG-2002


Subject:               MOTOROLA PRODUCT BULLETIN 7917
TITLE:
20X20 LQFP ASSY MOVE FROM SHC TO KLM

EFFECTIVE DATE:        20-Aug-2002


AFFECTED CHANGE CATEGORIES
  • MOTOROLA ASSEMBLY SITE


  • AFFECTED PRODUCT DIVISIONS
  • WIRELESS COMMUNICATIONS DIV (VC)
  • ADVANCED VEHICLE SYS DIV (JB)
  • WIRELESS INFRASTRCT SYS DIV (NH
  • BODY ELECT, OCCUPANT SAFETY (JD
  • RF/IF DIV (VW)
  • CPD- COMPUTING PLATFORM DIVISION (NR)
  • NETWORK & COMM SYS DIV (NM)
  • SMARTMOS PROD TECH CTR (JS
  • DRIVER INFORMATION DIVISION (JI)
  • NETWORK & COMM SYS DIV (NB)
  • BRD. AND ENT. DIVISION BESD (VE)
  • MULTIMEDIA SYSTEMS (ND)

  • ADDITIONAL RELIABILITY DATA: None
    REFERENCE: Contact Sales Office ()

    SAMPLES: Contact Local Sales Office
    REFERENCE: Contact Sales Office ()
    Contact your local Motorola Sales Office.

    For any questions concerning this notification:
    REFERENCE: Contact Sales Office (ALLISON ADCOCK)

    DISCLAIMER
          DISCLAIMER:
         
          MOTOROLA CONSIDERS THIS CHANGE APPROVED UNLESS SPECIFIC CONDITIONS
          OF ACCEPTANCE ARE PROVIDED IN WRITING. TO DO SO, CONTACT YOUR LOCAL
          MOTOROLA SALES OFFICE.

    DO NOT REPLY TO THIS MESSAGE.
    GPCN FORMAT:           CUSTOMER

    DESCRIPTION AND PURPOSE

          This notification is an update to the Final Manufacturing Assembly
          Consolidations Product Change Notifications that announced the
          qualification plan for all products that will be moved out of their
          current site, Silicon Harbor (Hong Kong- SHC) or Sendai (Japan-
          SDI), into a Motorola qualified assembly site in Kuala Lumpur,
          Malaysia (KLM) or Tianjin, China (BAT3) or subcontractor. All
          assembly qualification exercises met all Motorola internal
          requirements and specifications and were performed by package
          family.
         
          This Product Bulletin provides the reliability results and announces
          the completion of the assembly package qualification for the 20x20
          LQFP (112,144 ld) Transfer from Silicon Harbor (Hong Kong- SHC)to
          Kuala Lumpur, Malaysia (KLM).
         
          Motorola continues to make substantial investments in both new
          technologies and improved manufacturing capabilities to provide you
         
          the highest quality and most reliable semiconductors in the
          industry. We believe that these actions will improve our ability to
          serve you in the future. We will strive to manage this transition to
          our mutual benefits.
         
          Please note: The Kuala Lumpur, Malaysia KLM Facility will be
          capable of starting the production ramp up of the 20x20 LQFP parts
          from Silicon Harbor (Hong Kong- SHC) immediately, contingent on
          customer approval.
         
          Please be aware that in order for Motorola to execute the
          closures/consolidations on time and complete, by the end of the year
          2002, during the production ramp up of the 20x20 LQFP parts, you
          could receive a mix of parts from both Hong Kong SHC and Kuala
          Lumpur, Malaysia-KLM, until the ramp up is fully completed in the
          newly qualified site, KLM.
         
          Related Product Notifications are listed below:
         
          PN# 7278: FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN# 7281: FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN# 7283: FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN# 7285: FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN# 7416: FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN# 7418: FINAL MANUFACTURING ASSY CONSOLIDATIONS
          PN# 7420: FINAL MANUFACTURING ASSY CONSOLIDATIONS

    QUALIFICATION PLAN

          The qualification exercise was performed by package family. The
          qualification met all Motorola internal requirements and
          specifications.

    RELIABILITY DATA SUMMARY

          Qualification of 20x20 LQFP (112,144ld)
         
         
          Technology & Package: 20x20LQFP (112,144ld)
          Qual Vehicle A: 912D60
          Q1 - 68HC912D60 (F73K)
          Q2 - 68HC912D60 (F73K)
          Q3 - 68HC912D60 (F73K)
          Device: XC68HC912D60CPV8
          Fab/Assy/Test: MOS12/KLM/KLM
          Die Size: 343x346 mils
          Hot: 125C Cold: -40C
         
          Qual Vehicle B: 912DA128
          Q4 - HC912DA128 (H55W)
         
          Device: XC912DG128CPV8
          Fab/Assy/Test: MOS12/KLM/KLM
          Die Size: 470x470 mils
          Hot: 125C Cold: -40C
         
          Qual Vehicle C: 912DG128A
          Q5 - (H20LQFPD31)
          Device: MC912DG128ACPV
          Fab/Assy/Test: TSMC2
          Die Size: 348x336 mils
          Hot: 125C Cold: -40C
         
          Qual Vehicle D: SGGT2003 (PowerStrike)
          Q6 - (H20LQFPD41)
          Device: SC550004CPV16C
          Fab/Assy/Test: MOS11/KLM/KLM
          Die Size: 302x296 mils
          Hot: 85C Cold: -40C
         
         
          PC (Preconditioning):
          Results: PASS
          Conditions: MSL3 (Moisture Sensitivity Level), 220C
          Q1: 0/231
          Q2: 0/231
          Q3: 0/231
          Q6: 0/154
          Conditions: MSL3 (Moisture Sensitivity Level), 240C
          Q4: 0/154
          Q5: 0/231
         
         
          HAST (Highly Accelerated Stress Test):
          Results: PASS
          Q1: 0/77
          Q2: 0/77
          Q3: 0/77
         
          AC (Autoclave): 96 hrs
          Results: PASS
          Q1: 0/77
          Q2: 0/77
          Q3: 0/77
          Q4: 0/77
          Q5: 0/77
          Q6: 0/77
         
          TC (Temp Cycle):
          Results: PASS
          Conditions: -65C to +150C for 500 cycles
          Q1: 0/77
          Q2: 0/77
          Q3: 0/77
          Q4: 0/77
          Q5: 0/77
          Q6: 0/77
         
          EV (External Visual Inspection):
          Results: PASS (ALL UNITS, ALL LOTS)
         
          PD (Physical Dimensions)
          Qual Point Requirements: Ppk greater than 1.66 or
          Cpk greater than 1.33
          Results: PASS
          Q1: 0/30
         
          BPS (Bond Pull Strength):
          Qual Point Requirements: Ppk greater than 1.66 or
          Cpk greater than 1.33
          Results: PASS
          Q1: Cpk = 5.3
          Q2: Cpk = 3.3
          Q3: Cpk = 2.9
          Q4: Cpk = 4.55
          Q5: Cpk = 4.27
          Q6: Cpk = 2.45
         
          BS (Bond Shear Test):
          Qual Point Requirements: Ppk greater than 1.66 or
          Cpk greater than 1.33
          Results: PASS
          Q1: Cpk = 2.7
          Q2: Cpk = 4.5
          Q3: Cpk = 3.7
          Q4: Cpk = 3.48
          Q5: Cpk = 1.69
          Q6: Cpk = 2.88
         
          SD (Solderability):
          Results: PASS
          Q1: 0/15
          Q2: 0/15
          Q3: 0/15
         
          GL (Electro-Thermally Induced Gate Leakage)155C, 4.0 min, +400/-400
          V
          Results: PASS
          Q1: 0/6
         
          ELFR (Early Life Failure Rate) 48 hrs @ 125C
          Results: PASS
          Q1: 1/800*
          Q2: 0/800
          Q3: 0/800
          * 1 pc elevated SIDD. Silicon substrate defect, not assembly
          related.
         
          ED (Electrical Distribution):
          Results: PASS - COMPLETE

    ELECTRICAL CHARACTERISTIC SUMMARY

          Passed, meets all electrical parametric requirements.

    CHANGED PART IDENTIFICATION

          The traceability codes for all parts included on this notification
          will reflect the KLM assembly site with "Q" as opposed to "H" which
          represents SHC.


    RELATED NOTIFICATIONS:
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    FINAL MANUFACTURING ASSY CONSOLIDATIONS
    AFFECTED DEVICE LIST
    PART
    DSP56303PV100
    DSP56303PV100B1
    DSP56303PV100R2
    DSPA56367PV150
    DSPB56362PV100
    DSPB56362PV120
    DSPB56366PV120
    DSPB56367PV150
    DSPC56367PV150
    DSPD56366PV120
    DSPF56362PV100
    DSPF56362PV120
    DSPH56362PV120
    KMC68331CPV25
    KMC912DG128ACPV
    KMC9S12DP256BMPV
    KMMC2107CFCPV33
    MC16Z1CPV20B1
    MC68302CPV16VC
    MC68302PV16C
    MC68302PV16VC
    MC68302PV20C
    MC68302PV20CB1
    MC68302PV25C
    MC68302PV33C
    MC68306PV16B
    MC68306PV20B
    MC68331CPV16
    MC68331CPV16B1
    MC68331CPV20
    MC68331CPV20B1
    MC68331CPV25
    MC68332ACPV16
    MC68332ACPV16B1
    MC68332ACPV20
    MC68332ACPV20B1
    MC68332ACPV25
    MC68332ACPV25B1
    MC68332AMPV20
    MC68332AVPV25
    MC68332GCPV16
    MC68332GCPV16B1
    MC68332GCPV20
    MC68332GCPV20B1
    MC68332GCPV25
    MC68332GVPV16
    MC68332GVPV16B1
    MC68332GVPV25
    MC68340CPV16E
    MC68340CPV25E
    MC68340PV16E
    MC68340PV16EB1
    MC68340PV16VE
    MC68340PV25E
    MC68CK16Z1CPV16
    MC68CK331CPV16
    MC68CK331CPV16B1
    MC68EN302CPV20BT
    MC68EN302PV20BT
    MC68EN302PV25BT
    MC68HC16Z1CPV16
    MC68HC16Z1CPV20
    MC68HC16Z1CPV25
    MC68HC16Z1MPV16
    MC68HC16Z3BCPV16
    MC68HC812A4CPV8
    MC68LK332ACPV16
    MC68LK332GCPV16
    MC68QH302PV25C
    MC68VZ328CPV
    MC68VZ328CPVR2
    MC68VZ328PV
    MC68VZ328PVR2
    MC912D60ACPV8
    MC912D60AMPV8
    MC912D60AVPV8
    MC912DG128ACPV
    MC912DG128ACPVR2
    MC912DG128AMPV
    MC912DG128AVPV
    MC912DT128ACPV
    PART
    MC912DT128AMPV
    MC912DT128AVPV
    MC9S12A128BCPV
    MC9S12A256BCPV
    MC9S12DB128BCPV
    MC9S12DB128BMPV
    MC9S12DG128BCPV
    MC9S12DG128BMPV
    MC9S12DG128BVPV
    MC9S12DG256BCPV
    MC9S12DG256BMPV
    MC9S12DG256BVPV
    MC9S12DJ128BCPV
    MC9S12DJ256BCPV
    MC9S12DJ256BMPV
    MC9S12DP256BCPV
    MC9S12DP256BMPV
    MC9S12DP256BVPV
    MC9S12DT128BCPV
    MC9S12DT256BCPV
    MC9S12DT256BMPV
    MC9S12DT256BVPV
    MC9SDG128BVPVR2
    MCLK332ACPV16B1
    MMC2001HCPV16B
    MMC2001HCPV33B
    MMC2107CFCPV33
    MMC2111LFCPV33
    MMC2111LFCPV33R2
    PC68332GCPV25A
    PC68332GVPV16A
    PC68332GVPV25A
    PC9S12D64CPV25
    PC9S12D64MFU25
    PC9S12D64MPV25
    PC9S12D64VFU25
    PC9S12D64VPV25
    PC9S12DB128CPV25
    PC9S12DB128MPV25
    PC9S12DG128CPV25
    PC9S12DG128MPV25
    PC9S12DG128VPV25
    PC9S12DG256CPV25
    PC9S12DG256VPV25
    PC9S12DP256CPV25
    PC9S12DP256MPV25
    PC9S12DP256VPV25
    PC9S12DT128MPV25
    PC9S12DT256MPV25
    PC9S12H128VPV
    PC9S12H256VFV
    PC9S12H256VPV
    PC9S12H64VPV
    PC9SDP256MPV25
    PC9SDP256MPV25R2
    SC431983CPV16
    SC431985CPV27
    SC511322CPV
    SC511322MPV
    SC511322VPV
    SC511323VPV
    SC511356DGCPV
    SC511356DGMPV
    SC511356DGVPV
    SC511357CPV8
    SC550004CPV16C
    SC550008CPV16B
    SC550008CPV16E
    SC68PM302PV16B
    SC68PM302PV25B
    SPAK302PV16VC
    SPAK302PV33C
    SPAK306PV20B
    SPAK340PV25E
    SPAKA56367PV150
    SPAKB56367PV150
    SPAKC56367PV150
    SPAKD56366PV120
    SPAKDSP303PV100
    SPAKVZ328CPV
    SPAKVZ328PV
    PART
    SPAKXC309PV100A
    SPMC16Z1CPV25
    SPMC68CK331CPV16
    SSP26905PV120
    XC370751FU
    XC509613CPV8R2
    XC511323VPV
    XC511325CPV8
    XC511325VPV8
    XC511337VPV
    XC511705VPV8R2
    XC550003CPV16B
    XC550007HCPV16A
    XC56309PV100A
    XC68C12A0CPV5
    XC68C812A4PV5
    XC68HC12A0CPV8
    XC68HC12D60PV
    XC68HC12DA128PV
    XC68HC812A4CPV8
    XC68HC912D60MPV8
    XC912DG128ACPV
    XCA56367PV150
    XCB56362PV100
    XCB56362PV120
    XCB56366PV120
    XCB56367PV150
    XCC56367PV150
    XCF5249LPV120
    XCF56362PV100
    XMC2111LFVPV33
    XMC2111LFVPV33R2