OL-BGU8006: WLCSP

Overview

wafer level chip-size package; 6 balls; 0.65 x 0.44 x 0.29 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-BGU8006	WLCSP	surface mount	bottom	UC	0.65 x 0.44 x 0.29	6	other

Manufacture Code	Reference Codes	Issue Date
WLCSP6		2012-07-25