OL-IP3047CX6: WLCSP


Overview

Wafer level chip-size package; 6 bumps (3 x 2)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP3047CX6 WLCSP surface mount bottom UC 1.6 x 1.15 x 0.65 6 other
Manufacture Code Reference Codes Issue Date
WLCSP6 ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06