OL-IP3053CX5: WLCSP


Overview

Wafer level chip-size package; 5 bumps (2-1-2)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP3053CX5 WLCSP surface mount bottom UC 0.96 x 1.28 x 0.65 5 other
Manufacture Code Reference Codes Issue Date
WLCSP5 ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06