OL-IP3088CX10: WLCSP


Overview

Wafer level chip-size package; 10 bumps (4-2-4)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP3088CX10 WLCSP surface mount bottom UC 1.96 x 1.28 x 0.65 10 other
Manufacture Code Reference Codes Issue Date
WLCSP10 ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06