OL-IP3088CX15: WLCSP


Overview

Wafer level chip-size package; 15 bumps (6-3-6)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP3088CX15 WLCSP surface mount bottom UC 2.96 x 1.28 x 0.65 15 other
Manufacture Code Reference Codes Issue Date
WLCSP15 ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06