OL-IP3088CX20: WLCSP


Overview

Wafer level chip-size package; 20 bumps (8-4-8)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP3088CX20 WLCSP surface mount bottom UC 3.96 x 1.28 x 0.65 20 other
Manufacture Code Reference Codes Issue Date
WLCSP20 ---(EIAJ);---(JEDEC);---(IEC) 2011-06-06