OL-IP3337CX18: WLCSP

Overview

Wafer level chip-size package; 18 bumps

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP3337CX18	WLCSP	surface mount	bottom	UC	2.06 x 1.66 x 0.61	18	other

Manufacture Code	Reference Codes	Issue Date
WLCSP18		2011-07-06