OL-IP4035CX24: WLCSP


Overview

Wafer level chip-size package; 24 bumps (5 x 5 - A1)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4035CX24 WLCSP surface mount bottom UC 2.45 x 2.41 x 0.65 24 other
Manufacture Code Reference Codes Issue Date
WLCSP24 ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26