OL-IP4035CX24: WLCSP

Overview

Wafer level chip-size package; 24 bumps (5 x 5 - A1)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4035CX24	WLCSP	surface mount	bottom	UC	2.45 x 2.41 x 0.65	24	other

Manufacture Code	Reference Codes	Issue Date
WLCSP24	---(EIAJ);---(JEDEC);---(IEC	2011-05-26