OL-IP4041CX25: WLCSP


Overview

Wafer level chip-size package; 25 bumps (5 x 5)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4041CX25 WLCSP surface mount bottom UC 2.41 x 2.41 x 0.65 25 other
Manufacture Code Reference Codes Issue Date
WLCSP25 ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26