OL-IP4044CX8: WLCSP


Overview

Wafer level chip-size package; 8 bumps; 1.49 x 1.46 x 0.70 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4044CX8 WLCSP surface mount bottom UC 8 other
Manufacture Code Reference Codes Issue Date
WLCSP8 (EIAJ);(JEDEC);IEC 2011-07-18