OL-IP4051CX11: WLCSP

Overview

Wafer level chip-size package; 11 bumps; 1.96 x 1.44 x 0.70 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4051CX11	WLCSP	surface mount	bottom	UC	1.96 x 1.44 x 0.70	11	other

Manufacture Code	Reference Codes	Issue Date
WLCSP11		2005-08-26