OL-IP4052CX20: WLCSP


Overview

Wafer level chip-size package; 20 bumps; 2.54 x 1.96 x 0.70 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4052CX20 WLCSP surface mount bottom UC 20 other
Manufacture Code Reference Codes Issue Date
WLCSP20 (EIAJ);(JEDEC);IEC 2011-06-06