OL-IP4064CX8: WLCSP


Overview

Wafer level chip-size package; 8 bumps; 1.41 x 1.41 x 0.7 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4064CX8 WLCSP surface mount bottom UC 1.41 x 1.41 x 0.7 8 other
Manufacture Code Reference Codes Issue Date
WLCSP8 2010-11-02