OL-IP4307CX4: WLCSP


Overview

Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4307CX4 WLCSP surface mount bottom WLCSP 0.76 x 0.76 x 0.66 4 other
Manufacture Code Reference Codes Issue Date
WLCSP4 (EIAJ);(JEDEC);IEC 2011-04-26