OL-IP4337CX18: WLCSP

Overview

WLCSP18: wafer level chip-size package; 18 bumps

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4337CX18	WLCSP	surface mount	bottom	UC	1.96 x 1.61 x 0.61	18	other

Manufacture Code	Reference Codes	Issue Date
WLCSP18	---(EIAJ);---(JEDEC);---(IEC	2011-05-26