OL-IP4337CX18: WLCSP


Overview

WLCSP18: wafer level chip-size package; 18 bumps
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4337CX18 WLCSP surface mount bottom UC 1.96 x 1.61 x 0.61 18 other
Manufacture Code Reference Codes Issue Date
WLCSP18 ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26