OL-IP4338CX24: WLCSP


Overview

WLCSP24: wafer level chip-size package; 24 bumps
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4338CX24 WLCSP surface mount bottom UC 1.96 x 2.01 x 0.61 24 other
Manufacture Code Reference Codes Issue Date
WLCSP24 ---(EIAJ);---(JEDEC);---(IEC) 2011-05-26