OL-IP4342CX5: WLCSP


Overview

Wafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4342CX5 WLCSP surface mount bottom UC 0.76 x 1.06 x 0.66 5 other
Manufacture Code Reference Codes Issue Date
WLCSP5 2008-08-15