OL-IP4342CX5: WLCSP

Overview

Wafer level chip-size package; 5 bumps; 0.76 x 1.06 x 0.66 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4342CX5	WLCSP	surface mount	bottom	UC	0.76 x 1.06 x 0.66	5	other

Manufacture Code	Reference Codes	Issue Date
WLCSP5		2008-08-15