OL-IP4343CX5_LF: WLCSP


Overview

Wafer level chip-size package; 5 bumps; 0.93 x 0.93 x 0.66 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4343CX5_LF WLCSP surface mount bottom UC 5 other
Manufacture Code Reference Codes Issue Date
WLCSP5 (EIAJ);(JEDEC);IEC 2011-07-18