OL-IP4350CX24: WLCSP

Overview

Wafer level chip-size package; 24 bumps; 2.11 x 1.95 x 0.70 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4350CX24	WLCSP	surface mount	bottom	UC	2.11 x 1.95 x 0.70	24	other

Manufacture Code	Reference Codes	Issue Date
WLCSP24		2011-06-06