OL-IP4351CX11: WLCSP


Overview

Wafer level chip-size package; 11 bumps; 1.61 x 1.21 x 0.70 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4351CX11 WLCSP surface mount bottom UC 11 other
Manufacture Code Reference Codes Issue Date
WLCSP11 (EIAJ);(JEDEC);IEC 2011-07-18