OL-IP4365CX11: WLCSP

Overview

Wafer level chip-size package; 11 bumps

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4365CX11	WLCSP	surface mount	bottom	UC	1.16 x 1.56 x 0.61	11	other

Manufacture Code	Reference Codes	Issue Date
WLCSP11		2011-07-06