OL-IP4366CX8: WLCSP

Overview

Wafer level chip-size package; 8 bumps (3 x 3 - A1)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4366CX8	WLCSP	surface mount	bottom	UC	1.16 x 1.16 x 0.61	8	other

Manufacture Code	Reference Codes	Issue Date
WLCSP8		2011-07-06