OL-IP4385CX4: WLCSP


Overview

Wafer level chip-size package; 4 bumps; 0.76 x 0.76 x 0.66 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4385CX4 WLCSP surface mount bottom UC 0.76 x 0.76 x 0.66 4 other
Manufacture Code Reference Codes Issue Date
WLCSP4 2007-09-03