OL-IP4852CX25: WLCSP

Overview

Wafer level chip-size package; 25 bumps; 2.01 x 2.01 x 0.66 mm

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-IP4852CX25	WLCSP	surface mount	bottom	UC	2.01 x 2.01 x 0.66	25	other

Manufacture Code	Reference Codes	Issue Date
WLCSP25		2006-09-23