OL-IP4853CX24: WLCSP


Overview

Wafer level chip-size package; 24 bumps; 2.01 x 2.01 x 0.66 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
OL-IP4853CX24 WLCSP surface mount bottom UC 2.01 x 2.01 x 0.66 24 other
Manufacture Code Reference Codes Issue Date
WLCSP24 (EIAJ);(JEDEC);IEC 2008-04-14