OL-LPC1102UK: WLCSP


Overview

Wafer level chip-size package; 16 bumps; 2.17 x 2.32 x 0.6 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 2.17 x 2.32 x 0.6 16 other
Manufacture Code Reference Codes Issue Date
WLCSP16 - - -(EIAJ);- - -(JEDEC);- - -(IEC) 2010-10-18
Part Description Quick access
Scalable Entry Level 32-bit Microcontroller (MCU) based on ARM Cortex-M0+/M0 Cores
Scalable Entry Level 32-bit Microcontroller (MCU) based on ARM Cortex-M0+/M0 Cores