OL-NTB0104UK: WLCSP


Overview

wafer level chip-size package, 12 bumps
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 1.2 x 1.6 x 0.56 12 other
Manufacture Code Reference Codes Issue Date
WLCSP12 ---(EIAJ);---(JEDEC);---(IEC) 2011-06-16