OL-NVT4555UK: WLCSP


Overview

wafer level chip-scale package, 12 balls; 1.19 x 1.62 x 0.56 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 1.19 x 1.62 x 0.56 12 other
Manufacture Code Reference Codes Issue Date
WLCSP12 ---(EIAJ);---(JEDEC);---(IEC) 2013-02-26
Part Description Quick access
SIM card interface level translator and supply voltage LDO