OL-NVT4857: WLCSP


Overview

wafer level chip-scale package; 20 bumps; 2.1 x 1.7 x 0.49 mm (Backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 2.1 x 1.7 x 0.49 20 plastic
Manufacture Code Reference Codes Issue Date
OL-NVT4857 2015-07-21