OL-NX18P3001UK: WLCSP

Overview

wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-NX18P3001UK	WLCSP	surface mount	bottom	UC	1.36 x 1.66 x 0.51	12	plastic

Manufacture Code	Reference Codes	Issue Date
OL-NX18P3001UK		2013-05-23