OL-NX1A4WP: WLCSP

Overview

wafer level chip-scale package; 42 bumps; 3.56 x 3.41 x 0.57 mm (backside coating included)

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-NX1A4WP	WLCSP	surface mount	bottom	UC	3.56 x 3.41 x 0.57	42	plastic

Manufacture Code	Reference Codes	Issue Date
OL-NX1A4WP		2015-01-19