OL-NX3DV1066: WLCSP

Overview

wafer level chip-size package; 16 bumps

Package Version	Package Name	Mount	Terminal Position	Package Style	Dimensions	Termination Count	Material
OL-NX3DV1066	WLCSP	surface mount	bottom	UC	1.36 x 1.36 x 0.435	16	other

Manufacture Code	Reference Codes	Issue Date
WLCSP16		2012-01-10