OL-NX3DV1066: WLCSP


Overview

wafer level chip-size package; 16 bumps
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 1.36 x 1.36 x 0.435 16 other
Manufacture Code Reference Codes Issue Date
WLCSP16 2012-01-10