OL-NX3P1108: WLCSP


Overview

wafer level chip-size package; 4 bumps; 0.96 x 0.96 x 0.55 mm (Backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 0.96 0.96 x 0.55 4 other
Manufacture Code Reference Codes Issue Date
WLCSP4 ---(EIAJ);---(JEDEC);---(IEC) 2012-07-02