OL-NX3P190: WLCSP


Overview

wafer level chip-size package.4 bumps; body 0.76 x 0.76 x 0.51 mm. (Backside Coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 0.76 x 0.76 x 0.51 4 other
Manufacture Code Reference Codes Issue Date
WLCSP4 ---(EIAJ);---(JEDEC);---(IEC) 2011-06-09