OL-NX5P2190: WLCSP


Overview

wafer level chip-scale package; 9 bumps; body 1.36 x 1.36 x 0.51 mm (Backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 1.36 x 1.36 x 0.51 9 plastic
Manufacture Code Reference Codes Issue Date
OL-NX5P2190 2014-02-14
Part Description Quick access