OL-NX5P3001: WLCSP


Overview

wafer level chip-scale package; 12 bumps; 1.36 x 1.66 x 0.51 mm, 0.4 mm pitch (Backside coating included)
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 1.36 x 1.66 x 0.51 12 plastic
Manufacture Code Reference Codes Issue Date
OL-NX5P3001 2013-05-23
Part Description Quick access