OL-NXH9003UK: WLCSP


Overview

wafer level chip-scale package; 89 bumps; 3.63 x 3.58 x 0.38 mm
Package Version Package Name Mount Terminal Position Package Style Dimensions Termination Count Material
WLCSP surface mount bottom UC 3.63 x 3.58 x 0.38 89 plastic
Manufacture Code Reference Codes Issue Date
OL-NXH9003UK (EIAJ);(JEDEC);IEC 2015-04-22